OptiComp Corporation is currently seeking an innovative, motivated, goal- oriented junior level Packaging Engineer. This position reports directly to the Lead Packaging Engineer in the engineering group, but may be required to assist and work with other engineers as necessary. The Junior Packaging Engineer will participate in various aspects of device packaging as it relates to high speed optoelectronic devices. This includes, but is not limited to die assembly, chip underfill, wire bonding, circuit board population, and board layout. In addition, daily tasks will include general lab maintenance, organization and documentation. The individual may be required to perform DC and high speed testing of optical devices, sub-assemblies, and assembled modules, and occasionally create LabView programs and process documentation. Daily interaction with engineers and other OptiComp staff will be required.

Job Requirements:

• Education: B.S. or M.S. in electrical engineering or related fields.
• Must possess good oral and written communication skills, good organizational skills, and work well in a team oriented environment.
• nowledge of optical sub-systems, optical alignment, and RF system characterization is preferred.
• Experience with LabView, PC Board layout software, and AutoCAD is a plus.
• Active hands-on approach to technology development is critical for this position.
• Must be a US Citizen
• References Required