OptiComp is seeking an innovative, motivated, goal-oriented Senior Packaging Engineer to work with a team of engineers designing, developing, and producing high-performance transceivers for space, aerospace and other demanding applications. This individual should have extensive experience in optoelectronic packaging including optical design and fiber alignment, RF board design, laser drivers and TIAs, and package assembly. This individual should also be familiar with VCSELs, photodetectors, WDM, high-speed characterization, and module qualification. This individual will be responsible for managing the transceiver design and packaging group and will work with other engineers in device development, optoelectronic testing, reliability, and optical networks in an interactive team environment.

Job Requirements:

• Education: M.S. or Ph.D. in Electrical Engineering or related fields.
• At least 5 years of industrial experience with a proven track record
• Extensive experience and knowledge in optoelectronic packaging and transceiver design
• Proven team leader with strong program management skills
• Experience transitioning conceptual designs to production is preferred
• Active hands-on approach to technology development
• Excellent communication skills
• US Persons Only
• References Required

• 100% company paid medical, dental, and vision for all employees and dependants
• 100% Company paid life insurance, short term, long term, and disability for employees
• 2 weeks paid vacation
• 1 week paid time off
• Company paid holidays
• 401 K plan
• Profit sharing plan
• Relocation package available for most positions